EMS 10

Multi Carrier Die Sorter

Fully automated and high-speed die sorter, it can handle any wafer sizes up to 300mm. Configurable for Multi carrier: Wafer frame 300mm wafer, JEDEC tray, Waffle/Gel Pack, Grip Ring and Tape & Reel.

Specifications

System Capability

UPH up to 10K (wafer size: 0.2x 0.3mm)

Number of Pick Up Head 24

Packages

WLCSP/ Unit Package

Input Module

Up to17” Wafer Frame

Up to 13" Hoop Ring

Waffle Pack

Gel Pack

Tape and Reel (Detaper)

Jedec Tray

Output Module

Up to17” Wafer Frame

Up to 13" Hoop Ring

Waffle Pack

Gel Pack

Tape and Reel

Jedec Tray

Vision Capabilities

Input Vision

Top Vision

Aligner Vision

Bottom Vision

Sidewall Vision Left

Sidewall Vision Right

Sidewall Vision Top

Sidewall Vision Bottom

Output Vision

Setup Vision

Facilities

415V, 3 Phase, 10A

6 Bar CDA at 200L/min

Vacuum - 80kPa @ 500 L/min

Humidity 18 ~ 70% RH Non-Condensing

20 ~ 30ºC

Machine Footprint

Width : 2300mm

Depth without TNR : 1800mm

Height without HEPA & Tower Light : 1850mm

Depth with TNR : 2500mm

Height with HEPA : 2200mm