With years of research and development, the EWS300 was developed based on the decade of experience in automation process resulting in the development of our state of art product, with the groundbreaking features that bring the product to a new level of simplicity, reliability and speed for automatic optical inspection solution.
Detecting wafer cosmetic defect, measurement, ink dot for wafer, probe mark & etc.
Recipe / Setup (On and Off-Line)
Automatic “golden die” image generation from production wafer.
Changeable with multiple lens, up to 0.35µm per pixel.
Up to 0.7µm.
Up to 0.7µm at 3 sigma.
Minimum Defect Detection
Up to 1µm.
Particles removal system
Wafer Map, SPC Analysis Report, KLARF