Semiconductor Wafer Tape

i.) *Back Grinding Tape

• PO base film
• Adhesive : Acrylic type
• UV/Non UV type

ii.) Dicing Tape

• Wafer/Package Dicing Tape
  
• Base Film : PVC/PO/PET
  
• Adhesive : Acrylic type
  
• UV/Non UV type

iii.) *Die Attach Tape (DAF)

• PO base film
• Adhesive : Acrylic type
• Application : Die to Die/Die to LF/
• Die to subs