Semiconductor Wafer Tape
i.) *Back Grinding Tape
- PO base film
- Adhesive : Acrylic type
- UV/Non UV type
![](http://estechs.com/wp-content/uploads/image-16.png)
ii.) Dicing Tape
- Wafer/Package Dicing Tape
- Base Film : PVC/PO/PET
- Adhesive : Acrylic type
- UV/Non UV type
![](http://estechs.com/wp-content/uploads/image-17.png)
iii.) *Die Attach Tape (DAF)
- PO base film
- Adhesive : Acrylic type
- Application : Die to Die/Die to LF/
- Die to subs
![](http://estechs.com/wp-content/uploads/image-17.png)
Remark : * under development stage