{"id":1359,"date":"2021-07-16T13:45:46","date_gmt":"2021-07-16T05:45:46","guid":{"rendered":"https:\/\/estechs.com\/?page_id=1359"},"modified":"2022-08-15T16:07:20","modified_gmt":"2022-08-15T08:07:20","slug":"ews300","status":"publish","type":"page","link":"https:\/\/estechs.com\/?page_id=1359","title":{"rendered":"EWS300"},"content":{"rendered":"

EWS 300<\/h2>\n

Microscopic Inspection System<\/h2>\n
\n

With years of research and development, the EWS300 was developed based on the decade of experience in automation process resulting in the development of our state of art product, with the groundbreaking features that bring the product to a new level of simplicity, reliability and speed for automatic optical inspection solution.<\/p>\n<\/div>\n

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Specifications<\/h2>\n

Inspection<\/h6>\n\n\n\n\n\n\n\n\n
Inspection Capabilities<\/td>\n\n

Detecting wafer cosmetic defect, measurement, ink dot for wafer, probe mark & etc.<\/p>\n<\/td>\n<\/tr>\n

Recipe \/ Setup (On and Off-Line)<\/td>\n\n

Automatic \u201cgolden die\u201d image generation from production wafer.
Interactive graphical tools for various zone definition.
User-defined detection parameters per defects and zones.<\/p>\n<\/td>\n<\/tr>\n

Resolution<\/td>\n\n

Changeable with multiple lens, up to 0.35\u00b5m per pixel.<\/p>\n<\/td>\n<\/tr>\n

Accuracy<\/td>\n\n

Up to 0.7\u00b5m.
Represents deviation between average of the distribution of results of repeated measurements of golden target and it certified value.<\/p>\n<\/td>\n<\/tr>\n

Repeatability<\/td>\n\n

Up to 0.7\u00b5m at 3 sigma.
Represents 3 sigma deviation value of the distribution of results of repeated measurements of the same real component.<\/p>\n<\/td>\n<\/tr>\n

Minimum Defect Detection<\/td>\n\n

Up to 1\u00b5m.<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

System Configuration<\/h5>\n\n\n\n\n\n
Factory Automation<\/td>\n\n

Secs\/Gem<\/p>\n<\/td>\n<\/tr>\n

Cleanliness<\/td>\n\n

Class 100\/1000<\/p>\n<\/td>\n<\/tr>\n

Particles removal system<\/td>\n\n

Hepa System<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Output<\/h5>\n\n\n\n
Output Data<\/td>\n\n

Wafer Map, SPC Analysis Report, KLARF<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Machine layout<\/h5>\n\n\n\n
Dimension<\/td>\n\n

L1620 x W2235 x H1950mm<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Wafer Handling<\/h5>\n\n\n\n\n\n\n\n
Wafer ID<\/td>\n\n

Reading capability: SEMI M12, M13, M1.15, T1.95
OCR
ECC200, T7 DtaMatrix, QR-Code
BC412, IBM412<\/p>\n<\/td>\n<\/tr>\n

Wafer Type<\/td>\n\n

Wafer & Film Frame Wafer<\/p>\n<\/td>\n<\/tr>\n

Supported Wafer Size<\/td>\n\n

6″, 8″ & 12″<\/p>\n<\/td>\n<\/tr>\n

Wafer Cassettes<\/td>\n\n

Standard Cassettes: Entegris, Empak or Fluoroware (FOUP Optional)<\/p>\n<\/td>\n<\/tr>\n

Wafer Handling<\/td>\n\n

Twin Arms Wafer Robot with Slot Sensor (Mapping)<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n