UDM100

De-panelling System Smart Solution for Semicon Packaging

Estek offers solutions for the entire spectrum for Integrated circuit depaneling operation. Our product range focuses on modern processes in electronic component production.

Depaneling system from Estek provide high-performance depaneling process which utilise ultrasonic technique for separating electronic components from wafer tape. The technique and principles we use are fast, reliable, and low-stress, and ensure maximum productivity and quality.

Specifications

Facilities

Voltage

240VAC Single Phase

Frequency

50/60 Hz

Power Consumption

2.4KVA

Temperature

20 ~ 30°C

Humidity

18 ~ 70% RH Non-Condensing

CDA

6 Bar 200L/M

Wafer Ring Handling

Wafer Ring Size

8" and 12"

Ring Handling

Gripper

Conversion Time (Standard)

5 mins

Dimension and Weight

Dimension (W x D x H)

1500 x 1000 x 2000mm

Weight (Net)

1000kg

Chamber

ESD Material

YES

ESD Air Circulation

YES

Canister Size

1.5" width & 3" width

For further information on our product & services

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