ETS 5000

Tray to Tray Inspection System

Fully automated high accuracy linear pick and place sorter for different output tray, include JEDEC, soft, special/customized tray with precise vision inspection capability. System is designed to handle sophisticated package (ie. CMOS sensor and special packages)

Specifications

Tray Type

JEDEC Tray
Soft Tray (Thermoform)
Special/Customized Tray

Inspection Capabilities

Top vision
Bottom Vision
Input Vision
Output Vision
Passive Component Vision
2D Matrix Inspection

Facilities

Voltage

415VAC 3 Phase

Frequency

50/60 Hz

Power Consumption

5KVA

Temperature

20 ~ 30°c

Humidity

18 ~ 70% RH Non-Condensing

CDA

6 Bar 200L/M

Special Features
Up to 6 individual Pick and Place heads with build-in following features:

Z-axis
Theta rotation
Force Sensor
Vacuum sensor
Flow Sensor

With the above capabilities, system can perform on the fly alignment during pick and place operation.

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